20.7.3.2 Inspection -- Chips, Wafers, PCB, PWB, VLSI, IC, Disks, etc.

Chapter Contents (Back)
Real Time Vision. Application, Inspection. PCB Inspection. Wafer Inspection. Defect Detection. Curcuit Inspection.
See also Texture for Defect Detection.

Orbotech Ltd.,
2001
WWW Link. Vendor, Inspection. Industrial inspection systems for semiconductors.

ICOS,
2007
WWW Link. Vendor, Inspection. Industrial inspection systems for semiconductors.

Watkins, L.S.,
Inspection of IC Photomasks with Intensity Spatial Filters,
PIEEE(57), 1969, pp. 1634-1639. BibRef 6900

Axelrod, N.N.,
Intensity Spatial Filtering Applied to Defect Detection in Integrated Circuit Photomasks,
PIEEE(60), 1972, pp. 447-448. BibRef 7200

Bourdelais, R.J., Colangelo, D., McFadyen, R.J., and Elliott, J.F.,
Instrument for Automatically Inspecting Integrated Circuit Masks for Pinholes and Spots,
US_Patent3,795,452, March 5, 1974.
WWW Link. BibRef 7403

Horn, B.K.P.[Berthold K.P.],
A Problem in Computer Vision: Orienting Silicon Integrated Circuit Chips for Lead Bonding,
CGIP(4), No. 3, September 1975, pp. 294-303.
Elsevier DOI BibRef 7509
Earlier:
Orienting Silicon Integrated Circuit Chips for Lead Bonding,
MIT AI Memo-323, January 1975. BibRef

Harlow, C.A., Henderson, S.E., Rayfield, D.A., Johnson, R.J., and Dwyer, III, S.J.,
Automated Inspection of Electronic Assemblies,
Computer(8), No. 4, April 1975, pp. 36-45. BibRef 7504

Olsen, O.A.,
Visual Method of Locating Faults in Printed Circuit Boards,
US_Patent3,976,383, August 24, 1976.
WWW Link. BibRef 7608

Baxter, D.W., and Shipway, R.E.,
Defect Inspection of Objects Such as Electronic Circuits,
US_Patent4,056,716, November 1, 1977.
WWW Link. BibRef 7711

McVey, E.S., van Tol, A.,
An experimental printed circuit board drilling system automated by pattern recognition,
PR(11), No. 4, 1979, pp. 271-276.
Elsevier DOI 0309
BibRef

Hsieh, Y.Y., and Fu, K.S.,
An Automatic Visual Inspection System for Integrated Circuit Chips,
CGIP(14), No. 4, December 1980, pp. 293-343.
Elsevier DOI BibRef 8012

Jarvis, J.F.,
A Method for Automating the Visual Inspection of Printed Wiring Boards,
PAMI(2), No. 1, January 1980, pp. 77-83. Inspection, PWB. BibRef 8001

Goto, N.[Nobuyuki], Kondo, T.[Takashi],
An Automatic Inspection System for Printed Wiring Board Masks,
PR(12), No. 6, 1980, pp. 443-455.
Elsevier DOI BibRef 8000

Pau, L.F.,
Integrated Testing and Algorithms for Visual Inspection of Integrated Circuits,
PAMI(5), No. 6, November 1983, pp. 602-608. BibRef 8311
Earlier:
Semiconductio IC's: Integrated Testing and Algorithms for Visual Inspection,
ICPR80(238-240). BibRef

IC testing system.

Baird, M.L.,
SIGHT-I: A Computer Vision System for Automated IC Chip Manufacture,
SMC(8), No. 2, February 1978, pp. 133-139. BibRef 7802
Earlier:
An Application ov Computer Vision to Automatic IC Chip Manufacture,
ICPR76(3-7). BibRef

West, M.A., de Foster, S., Baldwin, E.C., Zeigler, R.A.,
Computer Controlled Optical Testing of High-Density Printed-Circuit Boards,
IBMRD(27), No. 1, 1983, pp. 50-58. BibRef 8300

Crabb, R.M.[Robert M.], de Foster, S.M.[Steven M.], Rittenhouse, N.E.[Norman E.], West, M.A.[Mark A.], Ziegler, R.A.[Richard A.],
System for measuring and detecting printed circuit wiring defects,
US_Patent4,650,333, March 17, 1987.
WWW Link. BibRef 8703

Wahl, F.[Friedrich], So, S.[Samuel], and Wong, K.[Kwan],
A Hybrid Optical-Digital Image Processing Method for Surface Inspection,
IBMRD(27), No. 4, July 1983, pp. 376-385. BibRef 8307

Rubat du Merac, C., Jutier, P., Laurent, J., Courtois, B.,
A New Domain for Image Analysis: VLSI Circuit Testing, with ROMULAD, Specialized in Parallel Image Processing,
PRL(1), 1983, pp. 347-357. BibRef 8300

Zeller, H., Doemens, G.,
Applications of Pattern Recognition in Semiconductor and Printer Board Production,
SP(5), 1983, pp. 399-412. BibRef 8300

Wilder, J.,
Machine Vision for Inspection of Keyboards,
SP(5), 1983, pp. 413-421. BibRef 8300

West, G.A.W.,
A System for the Automatic Visual Inspection of Bare-Printed Circuit Boards,
SMC(14), 1984, pp. 767-773. BibRef 8400

Nakashima, M.[Masato], Koezuka, T.[Tetsuo], Inagaki, T.[Takefumi],
Recognition method and apparatus,
US_Patent4,450,579, May 22, 1984
WWW Link. BibRef 8405

Mandeville, J.R.,
Novel Method for Analysis of Printed Circuit Images,
IBMRD(29), No. 1, January 1985, pp. 73-86. BibRef 8501

Bixler, J.P., Sanford, J.P.,
A Technique for Encoding Lines and Regions in Engineering Drawings,
PR(18), No. 5, 1985, pp. 367-377.
Elsevier DOI BibRef 8500

Yoda, H., Ohuchi, Y., Taniguchi, Y., and Ejiri, M.,
An Automatic Wafer Inspection System Using Pipelined Image Processing Techniques,
PAMI(10), No. 1, January 1988, pp. 4-16.
IEEE DOI BibRef 8801

Hara, Y., Doi, H., Karasaki, K., and Iida, T.,
A System for PCB Automated Inspection Using Fluorescent Light,
PAMI(10), No. 1, January 1988, pp. 69-78.
IEEE DOI BibRef 8801

Shu, D.B., Li, C.C., Mancuso, J.F., and Sun, Y.N.,
A Line Extraction Method for Automated SEM Inspection of VLSI Resist,
PAMI(10), No. 1, January 1988, pp. 117-120.
IEEE DOI BibRef 8801

Ando, M., Inagaki, T.,
Automatic Optical Inspection of Plated Through-Holes for Ultrahigh Density Printed Wiring Boards,
MVA(1), 1988, pp. 175-181. BibRef 8800

Dom, B.E., Brecher, V.H., Bonner, R., Batchelder, J.S., Jaffe, R.S.,
The P300: A System for Automatic Pattern Wafer Inspection,
MVA(1), 1988, pp. 205-221. BibRef 8800

Hara, Y., Akiyama, N., and Karasaki, K.,
Automatic Inspection System for Printed Circuit Boards,
PAMI(5), No. 6, November 1983, pp. 623-630. Vertical and diagonal lighting to make the metal pattern more obvious, then the inspection becomes easier. BibRef 8311

Hara, Y., Okamoto, K., Hamada, T., Akiyama, N., Nakagawa, K., Torisawa, S., and Nakashima, S.,
Automatic Visual Inspection of LSI Photomasks,
ICPR80(273-279). BibRef 8000

Sanz, J.L.C., and Petkovic, D.,
Machine Vision Algorithms for Automated Inspection of Thin-Film Disk Heads,
PAMI(10), No. 6, November 1988, pp. 830-848.
IEEE DOI Inspection, Disk Heads. Real system to inspect disk head assemblies. Not much new from the vision point of view, except that it works. BibRef 8811

Sanz, J.L.C., Dinstein, I., and Petkovic, D.,
Computing Multi-Colored Polygonal Masks in Pipeline Architectures and Its Application to Automated Visual Inspection,
CACM(30), No. 4, April 1987, pp. 318-329. The different templates (colors of polygons) are used to find features in the image which can then be closely inspected. BibRef 8704

Petkovic, D., Hinkle, E.B.,
A Rule-Based System for Verifying Engineering Specifications in Industrial Visual Inspection Applications,
PAMI(9), No. 2, March 1987, pp. 306-311. BibRef 8703

Dom, B., Steele, D., Petkovic, D., Kuhlmann, L.,
Algorithms for automatic disk head/slider inspection,
ICPR94(A:295-300).
IEEE DOI 9410
BibRef

Petkovic, D., Sanz, J.L.C., Mohiuddin, K.M.A., Hinkle, E.B., Flickner, M.D., Cox, C., Wong, K.,
An Experimental System for Disk Head Inspection,
ICPR86(9-13). BibRef 8600

Sprague, A.P., Donahue, M.J., and Rokhlin, S.I.,
A Method for Automatic Inspection of Printed Circuit Boards,
CVGIP(54), No. 3, November 1991, pp. 401-415.
Elsevier DOI Find features in the pattern and match to features in the reference graph pattern. BibRef 9111

Wojcik, Z.M.[Zbigniew M.],
An Approach to the Recognition of Contours and Line-Shaped Objects,
CVGIP(25), No. 2, February 1984, pp. 184-204.
Elsevier DOI Linear Features. The use of some line analysis techniques that extend to PCB inspection. BibRef 8402

Ellison, T.P.[Timothy P.], Taylor, C.J.[Christopher J.],
Calculating the surface topography of integrated circuit wafers from SEM images,
IVC(9), No. 1, February 1991, pp. 3-9.
Elsevier DOI 0401
BibRef
Earlier: BMVC90(xx-yy).
PDF File. 9009
BibRef

Yu, K.K.[Kenneth K.], Berglund, C.N.[C. Neil],
Automated system for extracting design and layout information from an integrated circuit,
US_Patent5,086,477, Feb 4, 1992
WWW Link. BibRef 9202

Lebeau, C.J.[Christopher J.],
Method for automatic semiconductor wafer inspection,
US_Patent5,129,009, Jul 7, 1992
WWW Link. BibRef 9207

Bushroe, M.W.[Michael W.],
Solder joint locator,
US_Patent5,164,994, Nov 17, 1992
WWW Link. BibRef 9211

Dom, B.E., Brecher, V.,
Recent Advances in the Automatic Inspection of Integrated-Circuits for Pattern Defects,
MVA(8), No. 1, 1995, pp. 5-19.
Springer DOI BibRef 9500

Khalaj, B.H., Aghajan, H.K., Kailath, T.,
Patterned Wafer Inspection By High-Resolution Spectral Estimation Techniques,
MVA(7), No. 3, 1994, pp. 178-185. BibRef 9400

Teoh, E.K., Mital, D.P.,
A Transputer-Based Automated Visual Inspection System for Electronic Devices and PCBs,
OptLas(22), No. 3, 1995, pp. 161-180. BibRef 9500

Moganti, M., Ercal, F., Dagli, C.H., Tsunekawa, S.,
Automatic PCB Inspection Algorithms: A Survey,
CVIU(63), No. 2, March 1996, pp. 287-313.
DOI Link Survey, Inspection. BibRef 9603

Rao, A.R.[A. Ravishankar],
Future-Directions in Industrial Machine Vision: A Case-Study of Semiconductor Manufacturing Applications,
IVC(14), No. 1, February 1996, pp. 3-19.
Elsevier DOI 9608
BibRef

Yuan, M.C., Li, J.G.,
A Production System for LSI Chip Anatomizing,
PRL(5), 1987, pp. 227-232. BibRef 8700

Blanz, W.E., Sanz, J.L.C., Hinkle, E.B.,
Image Analysis Methods for Solder-Ball Inspection in Integrated Circuit Manufacturing,
RA(4), 1988, pp. 129-139. BibRef 8800

Chou, P.B., Rao, A.R., Sturzenbecker, M.C., Wu, F.Y., Brecher, V.H.,
Automatic Defect Classification for Semiconductor Manufacturing,
MVA(9), No. 4, 1997, pp. 201-214.
Springer DOI Visual Inspection. BibRef 9700

An, J.N., Cho, Y.B., Gweon, D.G.,
A New Method for Image Separation of Overlapped Images from a Two-Layered Printed Circuit Board (PCB),
IVC(15), No. 11, November 1997, pp. 861-866.
Elsevier DOI 9712
BibRef

Kim, S.W., Lee, S.Y., Yoon, D.S.,
Rapid Pattern Inspection of Shadow Masks by Machine Vision Integrated with Fourier Optics,
OptEng(36), No. 12, December 1997, pp. 3309-3311. 9801
BibRef

Zhou, H., Kassim, A.A., Ranganath, S.,
A Fast Algorithm for Detecting Die Extrusion Defects in IC Packages,
MVA(11), No. 1, 1998, pp. 37-41.
Springer DOI 9808
BibRef

Kassim, A.A., Zhou, H., Ranganath, S.,
Automatic IC orientation checks,
MVA(12), No. 3, 2000, pp. 107-112.
Springer DOI 0010
BibRef

Nichani, S.[Sanjay], Scola, J.[Joseph],
Semiconductor device image inspection utilizing image subtraction and threshold imaging,
US_Patent5,949,901, Sep 7, 1999
WWW Link. BibRef 9909

Ichikawa, I.[Iwao],
Laser beam inspection apparatus,
US_Patent6,618,135, Sep 9, 2003
WWW Link. BibRef 0309

Chung, H.K., Park, R.H.,
2-Stage High-Precision Visual Inspection of Surface Mount Devices,
JEI(6), No. 4, October 1997, pp. 517-524. 9807
BibRef

Moganti, M.[Madhav], Ercal, F.[Fikret],
A Subpattern Level Inspection System for Printed Circuit Boards,
CVIU(70), No. 1, April 1998, pp. 51-62.
DOI Link BibRef 9804

Moganti, M.[Madhav], Ercal, F.[Fikret],
Segmentation of Printed Circuit Board Images into Basic Patterns,
CVIU(70), No. 1, April 1998, pp. 74-86.
DOI Link BibRef 9804

Fadzil, A.[Ahmad], Weng, C.J.[Chu Jenn],
LED Cosmetic Flaw Inspection System,
PAA(1), No. 1, 1998, pp. 62-70. BibRef 9800

Rodriguez, A.A., Mandeville, J.R.,
Image registration for automated inspection of printed circuit patterns using CAD reference data,
MVA(6), No. 4, 1993, pp. 233-242. BibRef 9300

Rajeswari, M., Rodd, M.G.,
Real-time Analysis of an IC Wire-bonding Inspection System,
RealTimeImg(5), No. 6, December 1999, pp. 409-421. 0003
BibRef

Beaty, E.M.[Elwin M.], Mork, D.P.[David P.],
Three dimensional inspection system,
US_Patent6,055,054, Apr 25, 2000
WWW Link. BibRef 0004

Xie, P.[Pin], Guan, S.U.[Sheng-Uei],
A golden-template self-generating method for patterned wafer inspection,
MVA(12), No. 3, 2000, pp. 149-156.
Springer DOI 0010
BibRef

Guan, S.U.[Sheng-Uei], Xie, P.[Pin], Li, H.[Hong],
A golden-block-based self-refining scheme for repetitive patterned wafer inspections,
MVA(13), No. 5-6, 2003, pp. 314-321.
WWW Link. 0304
BibRef

Guan, S.U.[Sheng-Uei], Xie, P.[Pin],
A golden block self-generating scheme for continuous patterned wafer inspections,
CIAP99(436-441).
IEEE DOI 9909
BibRef

Zoroofi, R.A.[Reza Aghaeizadeh], Taketani, H.[Hisashi], Tamura, S.[Shinichi], Sato, Y.[Yoshinobu], Sekiya, K.[Kazuma],
Automated inspection of IC wafer contamination,
PR(34), No. 6, June 2001, pp. 1307-1317.
Elsevier DOI 0103
BibRef

van Dop, E.R.[Erik R.], Regtien, P.P.L.[Paul P.L.],
Multi-sensor recognition of electronic components,
MVA(12), No. 5, 2001, pp. 213-222.
Springer DOI 0103
BibRef

Ye, Q.Z., Ong, S.H., Han, X.,
A stereo vision system for the inspection of IC bonding wires,
IJIST(11), No. 4, 2001, pp. 254-262.
WWW Link. 0105
BibRef

Bréhélin, L.[Laurend], Gascuel, O.[Olivier], Caraux, G.[Gilles],
Hidden Markov Models with Patterns to Learn Boolean Vector Sequences and Application to the Built-In Self-Test for Integrated Circuits,
PAMI(23), No. 9, September 2001, pp. 997-1008.
IEEE DOI 0110
Variation of HMM. BibRef

Qu, G.Y.[Gong-Yuan], Wood, S.L.[Sally L.], Teh, C.[Cho],
Wafer Defect Detection Using Directional Morphological Gradient Techniques,
JASP(2002), No. 7, July 2002, pp. 686-703. 0208
BibRef

Tobin, K.W.[Kenneth W.], Karnowski, T.P.[Thomas P.], Arrowood, L.F.[Lloyd F.], Ferrell, R.K.[Regina K.], Goddard, J.S.[James S.], Lakhani, F.[Fred],
Content-Based Image Retrieval for Semiconductor Process Characterization,
JASP(2002), No. 7, July 2002, pp. 704-713. 0208
BibRef

Tsai, D.M., Chou, C.C.,
A fast focus measure for video display inspection,
MVA(14), No. 3, July 2003, pp. 192-196.
Springer DOI 0308
BibRef

Roh, Y.J.[Young Jun], Park, W.S.[Won Shik], Cho, H.S.[Hyung-Suck],
Correcting image distortion in the X-ray digital tomosynthesis system for PCB solder joint inspection,
IVC(21), No. 12, November 2003, pp. 1063-1075.
Elsevier DOI 0310
BibRef

Baidyk, T., Kussul, E., Makeyev, O., Caballero, A., Ruiz, L., Carrera, G., Velasco, G.,
Flat image recognition in the process of microdevice assembly,
PRL(25), No. 1, January 2004, pp. 107-118.
Elsevier DOI 0311
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Toledo, G.K.[Gengis K.], Kussul, E.[Ernst], Baidyk, T.[Tatiana],
Neural classifier for micro work piece recognition,
IVC(24), No. 8, August 2006, pp. 827-836.
Elsevier DOI 0608
Neural network; Object recognition; Position recognition; Microassembly BibRef

Toledo, G.K.[Gengis K.], Kussul, E.[Ernst], Baidyk, T.[Tatiana],
Work piece recognition based on the permutation neural classifier technique,
MVA(22), No. 3, May 2011, pp. 495-504.
WWW Link. 1104
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Fang, T.[Tong], Jafari, M.A.[Mohsen A.], Danforth, S.C.[Stephen C.], Safari, A.[Ahmad],
Signature analysis and defect detection in layered manufacturing of ceramic sensors and actuators,
MVA(15), No. 2, December 2003, pp. 63-75.
Springer DOI 0401
BibRef

Zervakis, M.E., Goumas, S.K., Rovithakis, G.A.,
A Bayesian Framework for Multilead SMD Post-Placement Quality Inspection,
SMC-B(34), No. 1, February 2004, pp. 440-453.
IEEE Abstract. 0403
BibRef
Earlier: A2, A3, A1:
A Bayesian image analysis framework for post-placement quality inspection of components,
ICIP02(II: 549-552).
IEEE DOI 0210
BibRef

Kubota, T.[Toshiro], Talekar, P.[Parag], Ma, X.Y.[Xian-Yun], Sudarshan, T.S.[Tangali S.],
A nondestructive automated defect detection system for silicon carbide wafers,
MVA(16), No. 3, May 2005, pp. 170-176.
Springer DOI 0505
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di Palma, F., de Nicolao, G., Miraglia, G., Pasquinetti, E., Piccinini, F.,
Unsupervised spatial pattern classification of electrical-wafer-sorting maps in semiconductor manufacturing,
PRL(26), No. 12, September 2005, pp. 1857-1865.
Elsevier DOI 0508
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Shankar, N.G., Zhong, Z.W.,
Improved segmentation of semiconductor defects using area sieves,
MVA(17), No. 1, April 2006, pp. 1-7.
Springer DOI 0604
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Lin, H.D.[Hong-Dar],
Tiny surface defect inspection of electronic passive components using discrete cosine transform decomposition and cumulative sum techniques,
IVC(26), No. 5, May 2008, pp. 603-621.
Elsevier DOI 0803
Tiny surface defect inspection; Electronic passive components; Discrete cosine transform decomposition; Cumulative sum technique BibRef

Watanabe, T.[Takashi], Kusano, A.[Akira], Fujiwara, T.[Takayuki], Koshimizu, H.[Hiroyasu],
3D Precise Inspection of Terminal Lead for Electronic Devices by Single Camera Stereo Vision,
IEICE(E91-D), No. 7, July 2008, pp. 1885-1892.
DOI Link 0807
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Kusano, A.[Akira], Watanabe, T.[Takashi], Funahashi, T.[Takuma], Koshimizu, H.[Hiroyasu],
Defect detection of terminal lead by single stereo vision,
FCV13(237-241).
IEEE DOI 1304
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Last, M.[Mark], Kandel, A.[Abraham],
Perception-based Analysis Of Engineering Experiments In The Semiconductor Industry,
IJIG(2), No. 1, January 2002, pp. 107-126. 0201
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Ng, A.N.Y.[Ada N.Y.], Lam, E.Y.[Edmund Y.], Chung, R.[Ronald], Fung, K.S.M.[Kenneth S.M.], Leung, W.H.,
Reference-free Machine Vision Inspection Of Semiconductor Die Images,
IJIG(9), No. 1, January 2009, pp. 133-152. 0903
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Chen, C.S.[Chin-Sheng], Yeh, C.W.[Chun-Wei], Yin, P.Y.[Peng-Yeng],
A novel Fourier descriptor based image alignment algorithm for automatic optical inspection,
JVCIR(20), No. 3, April 2009, pp. 178-189.
Elsevier DOI 0903
Fourier descriptor; Image alignment; Automatic optical inspection; Component detection; Contour tracing; Run length encoding; Blobs tables; Phase-shifted technique BibRef

Chang, C.Y., Li, C.H., Lin, S.Y., Jeng, M.,
Application of Two Hopfield Neural Networks for Automatic Four-Element LED Inspection,
SMC-C(39), No. 3, May 2009, pp. 352-365.
IEEE DOI 0904
BibRef

Tsai, D.M.[Du-Ming], Chang, C.C.[Chih-Chieh], Chao, S.M.[Shin-Min],
Micro-crack inspection in heterogeneously textured solar wafers using anisotropic diffusion,
IVC(28), No. 3, March 2010, pp. 491-501.
Elsevier DOI 1001
Defect detection; Heterogeneous texture; Anisotropic diffusion; Micro-crack; Solar wafer BibRef

Zontak, M.[Maria], Cohen, I.[Israel],
Defect detection in patterned wafers using anisotropic kernels,
MVA(21), No. 2, February 2010, pp. xx-yy.
Springer DOI 1002
BibRef

Sun, T.H.[Te-Hsiu], Tseng, C.C.[Chun-Chieh], Chen, M.S.[Min-Sheng],
Electric contacts inspection using machine vision,
IVC(28), No. 6, June 2010, pp. 890-901.
Elsevier DOI 1003
Machine vision; Surface defects; Electric contact; Quality control BibRef

Fan, S.K.S.[Shu-Kai S.], Chuang, Y.C.A.[Yu-Chi-Ang],
Automatic detection of Mura defect in TFT-LCD based on regression diagnostics,
PRL(31), No. 15, 1 November 2010, pp. 2397-2404.
Elsevier DOI 1003
TFT-LCD manufacturing; Mura defect detection; Regression diagnostics; PRESS residuals BibRef

Zhang, J.[Jun], Kim, Y.[Yongsik], Yang, S.H.[Seung-Hune], Milster, T.D.[Tom D.],
Illumination artifacts in hyper-NA vector imaging,
JOSA-A(27), No. 10, October 2010, pp. 2272-2284.
WWW Link. 1011
In microscopic system for photomask, wafer analysis. BibRef

He, X.F.[Xing-Fei], and Fang, F.[Frank],
Flat-Panel Color Filter Inspection,
VisSys(16), No. 5, May 2011, pp. xx-yy.
HTML Version. 1107
Inspection of flat-panel displays with line-scan cameras BibRef

Benedek, C.[Csaba],
Detection of soldering defects in Printed Circuit Boards with Hierarchical Marked Point Processes,
PRL(32), No. 13, 1 October 2011, pp. 1535-1543.
Elsevier DOI 1109
Marked Point Process; PCB; Scooping BibRef

Peng, Y.[Yao], Zhang, J.Y.[Jin-Yu], Wang, Y.[Yan], Yu, Z.P.[Zhi-Ping],
Gradient-Based Source and Mask Optimization in Optical Lithography,
IP(20), No. 10, October 2011, pp. 2856-2864.
IEEE DOI 1110
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Long, T.[Ting], Wang, H.[Houjun], Long, B.[Bing],
Test generation algorithm for analog systems based on support vector machine,
SIViP(5), No. 4, November 2011, pp. 527-533.
WWW Link. 1111
Circuit testing. BibRef

Ibrahim, A.[Abdelhameed], Tominaga, S.[Shoji], Horiuchi, T.[Takahiko],
Invariant representation for spectral reflectance images and its application,
JIVP(2011), No. 1 2011, pp. xx-yy.
DOI Link 1203
BibRef
Earlier:
Spectral Invariant Representation for Spectral Reflectance Image,
ICPR10(2776-2779).
IEEE DOI 1008
BibRef
Earlier:
Material Classification for Printed Circuit Boards by Spectral Imaging System,
CCIW09(216-225).
Springer DOI 0903
BibRef

Horiuchi, T.[Takahiko], Ibrahim, A.[Abdelhameed], Kadoi, H.[Hideki], Tominaga, S.[Shoji],
An Effective Method for Illumination-Invariant Representation of Color Images,
Color12(II: 401-410).
Springer DOI 1210
BibRef
Earlier: A2, A1, A4, Only:
Illumination-invariant representation for natural color images and its application,
Southwest12(157-160).
IEEE DOI 1205
BibRef

Tominaga, S., Okamoto, S.,
Reflectance-based material classification for printed circuit boards,
CIAP03(238-243).
IEEE DOI 0310
BibRef

Horiuchi, T.[Takahiko], Suzuki, Y.[Yuhei], Tominaga, S.[Shoji],
Material Classification for Printed Circuit Boards by Kernel Fisher Discriminant Analysis,
CCIW11(152-164).
Springer DOI 1104
BibRef

Choy, S.K.[Siu Kai], Jia, N.N.[Ning-Ning], Tong, C.S.[Chong Sze], Tang, M.L.[Man Lai], Lam, E.Y.[Edmund Y.],
A Robust Computational Algorithm for Inverse Photomask Synthesis in Optical Projection Lithography,
SIIMS(5), No. 1 2012, pp. 625-651.
DOI Link 1205
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Jia, N.N.[Ning-Ning], Lam, E.Y.[Edmund Y.],
Stochastic gradient descent for robust inverse photomask synthesis in optical lithography,
ICIP10(4173-4176).
IEEE DOI 1009
BibRef

Yu, J.C.[Jue-Chin], Yu, P.[Peichen], Chao, H.Y.[Hsueh-Yung],
Library-Based Illumination Synthesis for Critical CMOS Patterning,
IP(22), No. 7, 2013, pp. 2811-2821.
IEEE DOI design automation; illumination source 1307
BibRef

Xu, S., Cheng, Z., Gao, Y., Pan, Q.,
Visual wafer dies counting using geometrical characteristics,
IET-IPR(8), No. 5, May 2014, pp. 280-288.
DOI Link 1407
BibRef

Duan, G.F.[Gui-Fang], Wang, H.C.[Hong-Cui], Liu, Z.Y.[Zhen-Yu], Tan, J.R.[Jian-Rong], Chen, Y.W.[Yen-Wei],
Automatic optical phase identification of micro-drill bits based on improved ASM and bag of shape segment in PCB production,
MVA(25), No. 6, 2014, pp. 1411-1422.
Springer DOI 1408
BibRef

Leibovici, M.C.R.[Matthieu C. R.], Gaylord, T.K.[Thomas K.],
Custom-modified three-dimensional periodic microstructures by pattern-integrated interference lithography,
JOSA-A(31), No. 7, July 2014, pp. 1515-1519.
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Microlithography BibRef

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IP(23), No. 8, August 2014, pp. 3560-3573.
IEEE DOI 1408
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Bernal, F.[Francisco], Acebrón, J.A.[Juan A.], Anjam, I.[Immanuel],
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Lakhssassi, A., Palenychka, R., Savaria, Y., Sayde, M., Zaremba, M.,
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IEEE DOI 1602
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Chebolu, A.[Aneissha], Nagahanumaiah,
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Sindagi, V.A.[Vishwanath A.], Srivastava, S.[Sumit],
Domain Adaptation for Automatic OLED Panel Defect Detection Using Adaptive Support Vector Data Description,
IJCV(122), No. 2, April 2017, pp. 193-211.
Springer DOI 1704
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Qiao, K.[Kai], Zeng, L.[Lei], Chen, J.[Jian], Hai, J.J.[Jin-Jin], Yan, B.[Bin],
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IET-IPR(12), No. 5, May 2018, pp. 793-800.
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SIViP(12), No. 4, May 2018, pp. 775-782.
Springer DOI 1805
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Kaur, B.[Beant], Kaur, G.[Gurmeet], Kaur, A.[Amandeep],
Detection of defective printed circuit boards using image processing,
IJCVR(8), No. 4, 2018, pp. 418-434.
DOI Link 1808
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Ashikin, F.[Fara], Hashizume, M.[Masaki], Yotsuyanagi, H.[Hiroyuki], Lu, S.K.[Shyue-Kung], Roth, Z.[Zvi],
A Design for Testability of Open Defects at Interconnects in 3D Stacked ICs,
IEICE(E101-D), No. 8, August 2018, pp. 2053-2063.
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Cheng, D.[Deruo], Shi, Y.Q.[Yi-Qiong], Gwee, B.H.[Bah-Hwee], Toh, K.A.[Kar-Ann], Lin, T.[Tong],
A Hierarchical Multiclassifier System for Automated Analysis of Delayered IC Images,
IEEE_Int_Sys(34), No. 2, March 2019, pp. 36-43.
IEEE DOI 1906
Shape, Integrated circuits, Libraries, Image segmentation, Intelligent systems, Transistors, Training BibRef

Han, H.[Hui], Gao, C.Q.[Chen-Qiang], Zhao, Y.[Yue], Liao, S.S.[Shi-Sha], Tang, L.[Lin], Li, X.D.[Xin-Dou],
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PRL(130), 2020, pp. 234-241.
Elsevier DOI 2002
Polycrystalline silicon wafer, RPN, Defects segmentation, CNN BibRef

Shen, J.Q.[Jia-Quan], Liu, N.Z.[Ning-Zhong], Sun, H.[Han],
Defect detection of printed circuit board based on lightweight deep convolution network,
IET-IPR(14), No. 15, 15 December 2020, pp. 3932-3940.
DOI Link 2103
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Mitic, V.[Vojislav], Serpa, C.[Cristina], Ilic, I.[Ivana], Mohr, M.[Markus], Fecht, H.J.[Hans-Jörg],
Fractal Nature of Advanced Ni-Based Superalloys Solidified on Board the International Space Station,
RS(13), No. 9, 2021, pp. xx-yy.
DOI Link 2105
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Frittoli, L.[Luca], Carrera, D.[Diego], Rossi, B.[Beatrice], Fragneto, P.[Pasqualina], Boracchi, G.[Giacomo],
Deep open-set recognition for silicon wafer production monitoring,
PR(124), 2022, pp. 108488.
Elsevier DOI 2203
Pattern classification, Open-set recognition, Sparse convolutions, Quality inspection, Wafer monitoring BibRef

Pan, J.W.[Jia-Wei], Zeng, D.Y.[De-Yu], Tan, Q.[Qi], Wu, Z.Z.[Zong-Ze], Ren, Z.G.[Zhi-Gang],
EU-Net: A novel semantic segmentation architecture for surface defect detection of mobile phone screens,
IET-IPR(16), No. 10, 2022, pp. 2568-2576.
DOI Link 2207
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Lin, G.[Guimin], Kong, L.F.[Ling-Feng], Liu, T.[Tianjian], Qiu, L.[Lida], Chen, X.[Xiyao],
An antagonistic training algorithm for TFT-LCD module mura defect detection,
SP:IC(107), 2022, pp. 116791.
Elsevier DOI 2208
Antagonistic training, Antagonistic samples, Mura defect, Classification network BibRef

Liu, Q.[Qunpo], Wang, M.[Mengke], Wang, H.X.[Hai-Xing], Hanajima, N.[Naohiko],
MPGI-Terminal defect detection based on M-FRCNN,
IET-IPR(17), No. 2, 2023, pp. 428-438.
DOI Link 2302
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Kim, B.J.[Bum Jun], Choi, H.[Hyeyeon], Jang, H.[Hyeonah], Lee, D.G.[Dong Gu], Jeong, W.[Wonseok], Kim, S.W.[Sang Woo],
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PRL(167), 2023, pp. 149-156.
Elsevier DOI 2303
Convolutional neural networks, Receptive field, Convolutional kernel, Model interpretation, Deep learning BibRef

Wang, Y.T.[Yu-Tong], Wang, J.G.[Jian-Gong], Cao, Y.S.[Yan-Song], Li, S.X.[Shi-Xing], Kwan, O.[Oliver],
Integrated Inspection on PCB Manufacturing in Cyber-Physical-Social Systems,
SMCS(53), No. 4, April 2023, pp. 2098-2106.
IEEE DOI 2303
Inspection, Mathematical models, Transformers, Solid modeling, Manufacturing processes, Task analysis, Production, integrated inspection BibRef

Zhao, J.[Jian], Zhu, B.[Bolin], Peng, M.[Mo], Li, L.L.[Ling-Ling],
Mobile phone screen surface scratch detection based on optimized YOLOv5 model (OYm),
IET-IPR(17), No. 5, 2023, pp. 1364-1374.
DOI Link 2304
BottleneckCSP, deep learning, defect detection, GhostNet, YOLOv5 BibRef

Boubaker, S.[Sahbi], Kamel, S.[Souad], Ghazouani, N.[Nejib], Mellit, A.[Adel],
Assessment of Machine and Deep Learning Approaches for Fault Diagnosis in Photovoltaic Systems Using Infrared Thermography,
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SP:IC(119), 2023, pp. 117043.
Elsevier DOI 2310
Convolutional neural network, Deep learning, Semantic segmentation, Defect detection BibRef

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An active learning method based on result quality evaluation for printed circuit board computed tomography image segmentation,
IET-IPR(17), No. 13, 2023, pp. 3688-3701.
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image segmentation, inverse problems, non-destructive testing BibRef

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PR(147), 2024, pp. 110124.
Elsevier DOI Code:
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Hierarchical reinforcement learning for chip-macro placement in integrated circuit,
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Image Retrieval in Semiconductor Manufacturing,
CIAP23(I:1-13).
Springer DOI 2312
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Xu, C.[Carol], Famouri, M.[Mahmoud], Bathla, G.[Gautam], Nair, S.[Saeejith], Shafiee, M.J.[Mohammad Javad], Wong, A.[Alexander],
CellDefectNet: A Machine-designed Attention Condenser Network for Electroluminescence-based Photovoltaic Cell Defect Inspection,
CRV22(219-223)
IEEE DOI 2301
Deep learning, Visualization, Photovoltaic cells, Neural networks, Inspection, Network architecture, deep learning, neural network, efficient architecture BibRef

Cai, L.[Lile], Pahwa, R.S.[Ramanpreet Singh], Xu, X.[Xun], Wang, J.[Jie], Chang, R.[Richard], Zhang, L.[Lining], Foo, C.S.[Chuan-Sheng],
Exploring Active Learning for Semiconductor Defect Segmentation,
ICIP22(1796-1800)
IEEE DOI 2211
Deep learning, Visualization, Microscopy, Bandwidth, Semiconductor device manufacture, Inspection, Benchmark testing, Semiconductor Structures BibRef

Yang, Y.F.[Yuan-Fu], Sun, M.[Min],
Semiconductor Defect Detection by Hybrid Classical-Quantum Deep Learning,
CVPR22(2313-2322)
IEEE DOI 2210
Deep learning, Machine learning algorithms, Program processors, Qubit, Pattern classification, Semiconductor device manufacture, Others BibRef

Barone, M.[Massimiliano],
Robust Image Wafer Inspection,
IPTA20(1-6)
IEEE DOI 2206
Image segmentation, Image registration, Layout, Very large scale integration, Inspection, Tools, Topology, space mapping BibRef

Bette, A.C.[Ann-Christin], Brus, P.[Patrick], Balazs, G.[Gabor], Ludwig, M.[Matthias], Knoll, A.[Alois],
Automated Defect Inspection in Reverse Engineering of Integrated Circuits,
WACV22(1809-1818)
IEEE DOI 2202
Integrated circuits, Training, Head, Reverse engineering, Layout, Manuals, Inspection, Industrial Inspection Datasets, Vision Systems and Applications BibRef

Li, F., Hu, G., Zhu, S.,
Weakly-Supervised Defect Segmentation Within Visual Inspection Images of Liquid Crystal Displays in Array Process,
ICIP20(743-747)
IEEE DOI 2011
Image segmentation, Inspection, Liquid crystal displays, Image reconstruction, Generators, Heating systems, Visualization, generative adversarial networks BibRef

El Bakkali, M., Elkhaldi, S., Elftouh, H., Touhami, N.A.,
Small-Signal Modeling of GaAs: pHEMT Using Direct Extraction Method,
ISCV20(1-5)
IEEE DOI 2011
equivalent circuits, high electron mobility transistors, III-V semiconductors, Scattering parameter BibRef

Mahalingam, G., Gay, K.M., Ricanek, K.,
PCB-METAL: A PCB Image Dataset for Advanced Computer Vision Machine Learning Component Analysis,
MVA19(1-5)
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image segmentation, learning (artificial intelligence), object detection, Inspection BibRef

di Bella, R.[Roberto], Carrera, D.[Diego], Rossi, B.[Beatrice], Fragneto, P.[Pasqualina], Boracchi, G.[Giacomo],
Wafer Defect Map Classification Using Sparse Convolutional Networks,
CIAP19(II:125-136).
Springer DOI 1909
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Kuo, C., Ashmore, J., Huggins, D., Kira, Z.,
Data-Efficient Graph Embedding Learning for PCB Component Detection,
WACV19(551-560)
IEEE DOI 1904
graph theory, image recognition, learning (artificial intelligence), object detection, Lighting BibRef

Alagic, D.[Dženana], Bluder, O.[Olivia], Pilz, J.[Jürgen],
Quantification and Prediction of Damage in SAM Images of Semiconductor Devices,
ICIAR18(490-496).
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Schrunner, S., Bluder, O., Zernig, A., Kaestner, A., Kern, R.,
Markov random fields for pattern extraction in analog wafer test data,
IPTA17(1-6)
IEEE DOI 1804
Markov processes, feature extraction, image processing, image restoration, materials testing, pattern classification, Wafer test data analysis BibRef

Park, Y.[Yang_Sub], Kang, K.[Kil_Bum], Kim, S.[Seong_Soo],
A Visual Inspection Method Based on Periodic Feature for Wheel Mark Defect on Wafer Backside,
CAIP17(I: 219-227).
Springer DOI 1708
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Wang, W.[Wei], Lei, X.[Xi], Ding, S.T.[Shan-Ting], He, X.F.[Xiao-Fan], Li, H.R.[Hao-Ran],
Optimal layout algorithm for reusing solar cell fragments,
ICIVC17(277-280)
IEEE DOI 1708
Algorithm design and analysis, Image edge detection, Layout, Logic gates, Partitioning algorithms, Photovoltaic cells, cutting path, edge recognition, layout algorithm, solar, cell, fragments BibRef

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A dataset for computer-vision-based PCB analysis,
MVA15(378-381)
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SCIA15(462-471).
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Matlin, E.[Erik], Troy, N.[Neil], Stoker, D.[David],
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ICIP14(5821-5825)
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Frequency modulation. More like brain signals than images. BibRef

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Evolving PCB visual inspection programs using genetic programming,
IVCNZ13(406-411)
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automatic optical inspection BibRef

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Automated Quality Inspection of Microfluidic Chips Using Morphologic Techniques,
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ACIVS09(400-409).
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IASP09(346-350).
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WSSIP08(331-334).
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Photogrammetric Analysis of Solar Collectors,
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Lin, H.D.[Hong-Dar], Chiu, S.W.[Singa Wang],
Computer-Aided Vision System for MURA-Type Defect Inspection in Liquid Crystal Displays,
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ICIP05(I: 369-372).
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El Doker, T.A., King, J., Scott, D.R.,
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Southwest04(124-127).
IEEE DOI 0411
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Choi, K.S.[Kang-Sun], Pyun, J.Y.[Jae-Young], Kim, N.H.[Nam-Hyeong], Choi, B.D.[Byeong-Doo], Ko, S.J.[Sung-Jea],
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Shimoda, A., Iwata, H., Shibata, Y., Ikeda, H.,
Thin Film Magnetic Head Wafer Inspection Technique Using Geometrical Feature Based Image Comparison,
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Machine Vision Inspection of VF Display Boards,
ICPR96(III: 839-843).
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Automatic Printed Circuit Pattern Inspection Using Connectivity Preserving Image Reduction and Connectivity Comparison,
ICPR92(I:53-56).
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Chehdi, K., Corazza, M.,
Automatic System of Quality Control of Hybrid Circuits by Image Analysis,
ICPR92(I:433-436).
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Khotanzad, A., Banerjee, H., Srinath, M.,
A vision system for inspection of ball bonds in integrated circuits,
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Khalaj, B.H., Aghajan, H.K., Kailath, T.,
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Chapter on Implementations and Applications, Databases, QBIC, Video Analysis, Hardware and Software, Inspection continues in
Inspection -- Solder Joints, Welding, Pipes .


Last update:Mar 16, 2024 at 20:36:19